B&R IP A06 X TO 11 Series Middle Layer Motherboard Tin Planting Platform

B&R IP-A06 Middle Layer Motherboard Tin Planting Platform for iPhone X/XS/XS Max/11/11 Pro/11Pro Max Features: iPhone middle layer tin planting platform, support iPhone X/XS/XS Max/11/11 Pro/11Pro Max middle layer and RF tin planting network Strong magnetic adsorption / precise positioning / double-sided design / fast tin planting Double-sided self-alignment design, support Phone X/XS/XS Max/11/11 Pro/11Pro Max RF tin planting Made of high-quality materials, resistant to high temperature of 700 degrees Celsius, no drum, no reflection, not easy to deform High precision and precise alignment, compatible with many models Slot type strong magnetic adsorption, strong magnetic plus steel mesh and bonding pad, automatic positioning without offset The design of rounded and square holes makes the steel mesh easier to remove tin, easier to plant tin, more durable and more efficient   Package includes: 1 x Tin-planting platform 5 x Stencil